Photosensitive or radiosensitive linear resin compositions, photoresist films, patterning methods, manufacturing methods of electronic devices, and compounds.

TW202631557APending Publication Date: 2026-08-01FUJIFILM CORP
View PDF 0 Cites 0 Cited by

Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
FUJIFILM CORP
Filing Date
2025-11-26
Publication Date
2026-08-01
Patent Text Reader

Abstract

The present invention provides a photosensitive radioactive or radioactive linear resin composition, a photoresist film formed using the above-mentioned photosensitive radioactive or radioactive linear resin composition, a pattern forming method using the above-mentioned photosensitive radioactive or radioactive linear resin composition, a method for manufacturing an electronic device, and a compound (A), wherein the above-mentioned photosensitive radioactive or radioactive linear resin composition contains a compound (A) represented by a specific formula, a photoacid generator (B) different from compound (A), and a resin (C).
Need to check novelty before this filing date? Find Prior Art