Photosensitive or radiosensitive linear resin compositions, photoresist films, patterning methods, manufacturing methods of electronic devices, and compounds.
TW202631557APending Publication Date: 2026-08-01FUJIFILM CORP
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Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- FUJIFILM CORP
- Filing Date
- 2025-11-26
- Publication Date
- 2026-08-01
Abstract
The present invention provides a photosensitive radioactive or radioactive linear resin composition, a photoresist film formed using the above-mentioned photosensitive radioactive or radioactive linear resin composition, a pattern forming method using the above-mentioned photosensitive radioactive or radioactive linear resin composition, a method for manufacturing an electronic device, and a compound (A), wherein the above-mentioned photosensitive radioactive or radioactive linear resin composition contains a compound (A) represented by a specific formula, a photoacid generator (B) different from compound (A), and a resin (C).
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