Photosensitive element, method for forming resist pattern, and method for producing printed wiring board

Abstract

A photosensitive element according to the present disclosure includes a support body and a photosensitive layer formed on the support body. The photosensitive layer contains a binder polymer, a photopolymerizable compound, a photopolymerization initiator, and a photopolymerization inhibitor. The photopolymerization inhibitor contains a catechol compound represented by Formula

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