Resins, methods for manufacturing resins, curable resin materials, prepregs, resin films, metal-clad laminates, printed circuit boards, and semiconductor packages.

Abstract

A resin comprising, in the reaction raw materials: an indene compound (A), a styrene compound (B) having an X-CH2- group (X being a detachable group), and an aromatic compound (C) having an X-CH2- group (X being a detachable group), wherein the aromatic compound (C) excludes the aforementioned styrene compound (B), and the area ratio of the component with a molecular weight of 1,000 or more in the GPC chart of the resin is 1.5% or less. none

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