Moisture-curing resin compositions, adhesives for electronic components, cured bodies, electronic components
TW202631705APending Publication Date: 2026-08-01SEKISUI CHEMICAL CO LTD
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Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- SEKISUI CHEMICAL CO LTD
- Filing Date
- 2025-09-05
- Publication Date
- 2026-08-01
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Figure TWG2TA001070347_001 
Figure TWG2TA001070347_002 
Figure TWG2TA001070347_003
Abstract
The moisture-curing resin composition of the present invention comprises a moisture-curing urethane resin (A), wherein the moisture-curing urethane resin (A) is formed by prepolymerizing at least polyol A and polyol B, which are polyols, through polyisocyanate. The polyol A is a linear polyol and the polyol B is a branched polyol. none
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