Methods for manufacturing embossing hardenable components, hardened materials, embossed patterns, and devices.

Abstract

The present invention provides a curing composition for embossing, a cured product of the above-mentioned curing composition for embossing, a method for manufacturing an embossed pattern using the above-mentioned curing composition for embossing, and a method for manufacturing a device including the above-mentioned method for manufacturing an embossed pattern. The curing composition for embossing comprises: a polymerizable compound; a polymerization initiator; and one or more organophosphorus compounds selected from the group consisting of organophosphoric acid derivatives, organophosphonic acid derivatives, and organophosphorus oxide derivatives in which the carbonyl group is not directly bonded to a phosphorus atom.