Reactive polycarboxylic acid compounds, active energy line curing resin compositions using them, their cured products, articles, and printed wiring boards

Abstract

The object of this invention is to provide a reactive polycarboxylic acid resin that possesses both heat resistance and substrate adhesion while exhibiting good development properties, and an active energy line-curing resin composition containing the same. Through diligent research, the inventors discovered that a reactive polycarboxylic acid compound (A) solves the aforementioned problem, thus achieving this invention. The reactive polycarboxylic acid compound (A) is obtained by reacting a carboxylic acid compound (b) containing both polymerizable vinyl unsaturated groups and carboxyl groups with an epoxy resin (a) represented by the following formula (1) to obtain a reactive epoxy carboxylic acid ester compound (c), and then reacting the reactive epoxy carboxylic acid ester compound (c) with a polybasic acid anhydride (d). (Where, n represents an average value and is a number from 1 to 15.)