Polymer compound, photosensitive resin composition, insulating film and electronic device comprising the same

TW202631714APending Publication Date: 2026-08-01DONGJIN SEMICHEM CO LTD
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
DONGJIN SEMICHEM CO LTD
Filing Date
2025-12-11
Publication Date
2026-08-01

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Abstract

This invention discloses a polymer compound exhibiting excellent sensitivity, electronic device reliability, and adhesive properties. According to one aspect, a polymer compound comprising at least one repeating unit shown in general formulas 1 and 2 is provided.
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