Photosensitive resin composition, photosensitive resin film, printed circuit board and manufacturing method thereof, and semiconductor package

Abstract

A photosensitive resin composition, a photosensitive resin film using the photosensitive resin composition, a printed circuit board and a method for manufacturing the same, and a semiconductor package, wherein the photosensitive resin composition comprises: (A) a photopolymerizable compound having an ethylene unsaturated group and an acidic substituent; (B) a compound having an isocyanurate ring or a glycourea ring and an ethylene unsaturated group; and (C) a maleimide resin having a condensed ring comprising an aromatic ring and an aliphatic ring and two or more N-substituted maleimide groups. none

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