Photocurable resin composition, cured material, laminate, manufacturing method of cured material, manufacturing method of laminate, manufacturing method of semiconductor device, and semiconductor device.

Abstract

The present invention provides a photocurable resin composition, a cured product formed by curing the photocurable resin composition, a laminate containing the cured product, a method for manufacturing the cured product, a method for manufacturing the laminate, a method for manufacturing a semiconductor device including the method for manufacturing the cured product, and a semiconductor device containing the cured product. The photocurable resin composition comprises: a photoradical polymerization initiator having a structure represented by the following formula (A-O); and a resin being at least one of a polyimide having a polymerizable group and a polyimide precursor having a polymerizable group.