Multifunctional vinyl compounds and their components, as well as hardeners

TW202631722APending Publication Date: 2026-08-01NIPPON STEEL CHEM & MATERIAL CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
NIPPON STEEL CHEM & MATERIAL CO LTD
Filing Date
2026-01-22
Publication Date
2026-08-01

Smart Images

  • Figure TWG2TA001071768_001
    Figure TWG2TA001071768_001
  • Figure TWG2TA001071768_002
    Figure TWG2TA001071768_002
  • Figure TWG2TA001071768_003
    Figure TWG2TA001071768_003
Patent Text Reader

Abstract

The purpose of this invention is to provide a compound with excellent solvent solubility, heat resistance, thermal decomposition stability, thermal conductivity, low dielectric constant, low dielectric loss tangent, and excellent flame retardancy, as well as a curable resin composition containing the compound. A polyfunctional vinyl compound represented by the following general formula (1) is obtained. In formula (1), X independently represents the structure shown in formula (2), benzonitrile structure, diphenylsulfonyl structure, xyleneyl structure, or -(CH2)m-, where m represents a number from 3 to 10, and n represents a number from 0 to 15.
Need to check novelty before this filing date? Find Prior Art