Resin composition, cured material, laminate, manufacturing method of cured material, manufacturing method of laminate, manufacturing method of semiconductor device, semiconductor device and polyimide

Abstract

The present invention provides a resin composition comprising a polyimide having repeating units represented by formula (A-1) and having free radical polymerizable groups, a cured product formed by curing the resin composition, a laminate containing the cured product, a method for manufacturing the cured product, a method for manufacturing the laminate, a method for manufacturing a semiconductor device including the method for manufacturing the cured product, a semiconductor device containing the cured product, and a polyimide having repeating units represented by formula (A-2) and repeating units represented by formula (A-3).