Methods for forming photosensitive elements and resist patterns and manufacturing printed circuit boards

Abstract

A photosensitive element comprising a support film and a photosensitive resin composition layer, wherein the thickness of the photosensitive resin composition layer is less than 10 μm, the photosensitive resin composition layer comprises a photosensitive resin composition comprising an adhesive polymer (A), a photopolymerizable compound (B), and a photopolymerization initiator (C), wherein the photopolymerization initiator (C) comprises a hexaarylbiimidazole compound (C1) having an alkoxy group having 3 or more carbon atoms in its molecular structure. none

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