Methods for manufacturing components for protective film formation, protective films, substrates, and semiconductor devices.

Abstract

The protective film forming composition of the present invention contains a polymer having repeating units represented by the following formula (1) and a solvent; the content of the aforementioned polymer is 80% by mass or more relative to the non-volatile components of the aforementioned protective film forming composition. (In formula (1), R1 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms. R2 represents a single bond or -CH2-. R3 represents a single bond or a divalent chain hydrocarbon group having 1 to 20 carbon atoms. X1 represents -O- or -NH-. Y1 represents -NH-, -S-, -C(=O)-O- or -OC(=O)-. n represents an integer from 2 to 5.)