Thermal set polyolefin resin
TW202631738APending Publication Date: 2026-08-01BLUE CUBE IP LLC
View PDF 0 Cites 0 Cited by
Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- BLUE CUBE IP LLC
- Filing Date
- 2025-04-24
- Publication Date
- 2026-08-01
Smart Images

Figure TWG2TA001070081_001 
Figure TWG2TA001070081_002
Abstract
Provided herein are curable multifunctional olefin resins, for example compounds of Formula I and Formula Ia, that can be used to prepare electrical laminates suitable for use in next-generation AI server applications. Also provided herein are processes for making the curable multifunctional olefin resins and related intermediate compounds. Also provided herein are curable compositions comprising a curable multifunctional olefin resin, optionally in combination with one or more other curable molecules or resins and / or one or more fillers or other optional components. Also provided herein are electrical laminates, and products that incorporate such laminates (e.g., printed circuit boards), that are prepared by curing a curable multifunctional olefin resin as described herein.
Need to check novelty before this filing date? Find Prior Art