Thermal set polyolefin resin

TW202631738APending Publication Date: 2026-08-01BLUE CUBE IP LLC
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
BLUE CUBE IP LLC
Filing Date
2025-04-24
Publication Date
2026-08-01

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Abstract

Provided herein are curable multifunctional olefin resins, for example compounds of Formula I and Formula Ia, that can be used to prepare electrical laminates suitable for use in next-generation AI server applications. Also provided herein are processes for making the curable multifunctional olefin resins and related intermediate compounds. Also provided herein are curable compositions comprising a curable multifunctional olefin resin, optionally in combination with one or more other curable molecules or resins and / or one or more fillers or other optional components. Also provided herein are electrical laminates, and products that incorporate such laminates (e.g., printed circuit boards), that are prepared by curing a curable multifunctional olefin resin as described herein.
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