Photosensitive resin composition, resin curing film, and image display element

TW202631741APending Publication Date: 2026-08-01RESONAC CORP
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
RESONAC CORP
Filing Date
2025-11-27
Publication Date
2026-08-01
Patent Text Reader

Abstract

A photosensitive resin composition comprising: copolymer (A-1), copolymer (A-2), photopolymerization initiator (C), and solvent (D), wherein copolymer (A-1) comprises: hydroxyl groups, a constituent unit (a) having a blocked isocyanate group, a constituent unit (b) having a partial structure of formula (1) below, and a constituent unit (c) having an acid group, and the unsaturated group equivalent of copolymer (A-2) is 30~3000 g / mol. (In formula (1), R1 is a divalent hydrocarbon group, and n1 represents an integer from 2 to 20.)
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