Curable resin compositions, curable compositions for metal-clad laminates, prepregs, resin films, metal-clad laminates, printed circuit boards, and semiconductor packages.
TW202631744APending Publication Date: 2026-08-01RESONAC CORP
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Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- RESONAC CORP
- Filing Date
- 2025-12-09
- Publication Date
- 2026-08-01
Abstract
A curable resin composition wherein the polymerizable compound (A) comprises 90% by mass or more of the total mass of the resin components, wherein the polymerizable compound (A) comprises a resin (A1) comprising an indenyl ring, vinylbenzyl and arylalkyl groups other than vinylbenzyl. none
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