Method for manufacturing radioactive linear components, curing films, display elements, and curing films.

TW202631747APending Publication Date: 2026-08-01JSR CORPORATION
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
JSR CORPORATION
Filing Date
2026-01-15
Publication Date
2026-08-01

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Abstract

The main objective of this invention is to provide a radiosensitive linear composition capable of forming a hardened film with a low relative permittivity, excellent flexural strength, excellent melt resistance, and low development residue. This invention is a radiosensitive linear composition comprising: a polymer component (A), a quinone diazide compound (B), and a solvent (C). In the radiosensitive linear composition, the polymer component (A) comprises, in the same polymer or different polymers: at least one structural unit (I) selected from the group consisting of structural units having an acid group and structural units derived from maleimine; a structural unit (II) containing an alicyclic epoxy group; a structural unit (III) derived from a (meth)acrylate having an alicyclic structure (excluding structural unit (II)); and a structural unit (IV) having a cyclic ether structure in the main chain and a methylene group bonded to the carbon atoms constituting the cyclic ether structure.
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