Adhesive kits and adhesive bodies and their manufacturing methods

TW202631753APending Publication Date: 2026-08-01RESONAC CORP
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
RESONAC CORP
Filing Date
2025-10-20
Publication Date
2026-08-01
Patent Text Reader

Abstract

An adhesive kit is disclosed, comprising a main agent containing a complexing agent and an initiator comprising at least one of the following: a compound selected from organoborane complexes, compounds represented by formula (1), and compounds represented by formula (2). At least one of the main agent and the initiator further comprises a compound having a free radical polymerizable group. At least one of the main agent and the initiator further comprises at least one of the following: a compound selected from a metal halide salt and a compound having a thiocarbonylsulfur structure. [In formula (1), R1, R2, and R3 independently represent alkyl groups.] [In formula (2), n represents an integer from 2 to 5. R4 represents an alkyl group. R5 and R6 independently represent a hydrogen atom or an alkyl group. In the case of a plurality of R5 and R6, the plurality of R5 and R6 may be the same or different.]
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