Maleimide resin mixtures, curable resin compositions and their cured products

Abstract

This invention provides a maleimide resin mixture with excellent low dielectric loss tangent and excellent storage stability in a varnish state, as well as a curable resin composition and its cured form. A maleimide resin mixture comprises a maleimide resin having repeating units of formulas (a) and (b) below, and a maleimide resin represented by formula (c) below, wherein the acid value of the maleimide resin mixture is 25 or less. (In the formulas, Ra represents a hydrogen atom or a hydrocarbon group having 1 to 5 carbon atoms; m is the average number of repeats, and 1 ≤ m < 200; n is the average number of repeats, and 1.1 ≤ n < 100; (a) and (b) are bonded at * respectively, and the repeating positions can be random.)

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