Curable silicone composition, cured body therefrom and manufacturing process thereof

TW202631758APending Publication Date: 2026-08-01DOW TORAY CO LTD
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
DOW TORAY CO LTD
Filing Date
2025-12-23
Publication Date
2026-08-01
Patent Text Reader

Abstract

The present invention provides a composition that may contain a large amount of functional inorganic filler. The composition in its uncured state is sufficiently hard at room temperature and has sufficient hardness even when compressed. It is characterized by high fluidity at high temperatures and can form a cured product with excellent heat-melting properties. Solution: A curable polysiloxane composition, its molded articles, and their uses, characterized in that the curable polysiloxane composition contains: (A) an organopolysiloxane resin with a softening point of 30°C or higher, having curing reactive functional groups, and containing 20 mol% or more of T units; (B) an organohydrogen polysiloxane; (C) thermoplastic resin microparticles containing a catalyst for hydrosiliconization reaction; (D) a functional inorganic filler; (E) an organopolysiloxane resin that does not have silanol reactive functional groups in its molecule, has a silanol group content of 5.0 mol% or less, and contains 20 mol% or more of T units; and the composition as a whole exhibits thermoplasticity. none
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