Photosensitive resin composition, photosensitive resin film, photosensitive dry film and pattern formation method
TW202631760APending Publication Date: 2026-08-01SHIN ETSU CHEMICAL CO LTD
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Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- SHIN ETSU CHEMICAL CO LTD
- Filing Date
- 2025-11-25
- Publication Date
- 2026-08-01
Abstract
The present invention provides a photosensitive resin composition comprising: (A) a polymer containing repeating units represented by formula (A1) and repeating units represented by formula (A2), having groups represented by formula (A3) at both ends, and having a weight average molecular weight of 3,000 to 100,000; and (B) a photoradical generator; (where X is a divalent group represented by the following formula; ).
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