Photosensitive resin composition, photosensitive element, printed circuit board, and method for manufacturing printed circuit board

TW202631761APending Publication Date: 2026-08-01RESONAC CORP
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
RESONAC CORP
Filing Date
2025-10-03
Publication Date
2026-08-01

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Abstract

The present invention discloses a photosensitive resin composition for use as a permanent photoresist, which contains an acid-modified vinyl resin, a photopolymerization initiator, a polyester elastomer, and at least one selected from the group consisting of a polymerization inhibitor and an ultraviolet absorber.
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