Light-curable resin compositions and molded articles comprising them, as well as electrical components.

Abstract

The present invention aims to provide a photocurable resin composition for obtaining molded articles possessing both high strength and low thermal expansion. The photocurable resin composition that solves the above problem comprises a multifunctional acrylic resin, silica particles, and a photopolymerization initiator. The multifunctional acrylic resin comprises 20% by mass and 80% by mass of a polycyclic aliphatic acrylic resin, and 20% by mass and 80% by mass of an isocyanuric acid-type acrylic resin. 50% of the silica particles have an average particle size of 30 nm or more and less than 1.0 μm, and the amount of silica particles relative to the total mass of the photocurable resin composition is 60% by mass and less than 80% by mass.

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