Moisture-curing polyurethane hot melt resin composition, adhesive and laminate

TW202631774APending Publication Date: 2026-08-01DIC CORP
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
DIC CORP
Filing Date
2025-12-02
Publication Date
2026-08-01
Patent Text Reader

Abstract

This invention provides a moisture-curing polyurethane hot melt resin composition, an adhesive, and a laminate with excellent drop impact resistance and heat creep resistance. One moisture-curing polyurethane hot melt resin composition contains an isocyanate prepolymer (i) having an isocyanate group, wherein the isocyanate prepolymer (i) is made from a polyol (A) and a polyisocyanate (B), and the ratio of the storage modulus E'(25) at 25°C to the storage modulus E'(60) at 60°C [E'(25) / E'(60)] of the cured product of the moisture-curing polyurethane hot melt resin composition is in the range of 1.0 to 10.0.
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