Methods for bonding moisture-curing polyurethane hot melt resin compositions, adhesives, laminates and substrates

TW202631775APending Publication Date: 2026-08-01DIC CORP
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
DIC CORP
Filing Date
2025-12-02
Publication Date
2026-08-01
Patent Text Reader

Abstract

This invention provides a moisture-curing polyurethane hot melt resin composition, adhesive, laminate, and bonding method for achieving fine-line coating and forming a cured film with excellent adhesion and drop impact resistance. A moisture-curing polyurethane hot melt resin composition contains a urethane prepolymer (i) having isocyanate groups, wherein the urethane prepolymer (i) is made from at least a polyol (A), a polyisocyanate (B), and a polyamine (C), wherein the polyol (A) comprises at least a polyether polyol (a1) and a polyacrylic acid polyol (a2), and the content of the polyamine (C) is in the range of 0.1 parts by weight to 1.0 parts by weight per 100 parts by weight of the urethane prepolymer (i).
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