Methods for bonding moisture-curing polyurethane hot melt resin compositions, adhesives, laminates and substrates
TW202631775APending Publication Date: 2026-08-01DIC CORP
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Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- DIC CORP
- Filing Date
- 2025-12-02
- Publication Date
- 2026-08-01
Abstract
This invention provides a moisture-curing polyurethane hot melt resin composition, adhesive, laminate, and bonding method for achieving fine-line coating and forming a cured film with excellent adhesion and drop impact resistance. A moisture-curing polyurethane hot melt resin composition contains a urethane prepolymer (i) having isocyanate groups, wherein the urethane prepolymer (i) is made from at least a polyol (A), a polyisocyanate (B), and a polyamine (C), wherein the polyol (A) comprises at least a polyether polyol (a1) and a polyacrylic acid polyol (a2), and the content of the polyamine (C) is in the range of 0.1 parts by weight to 1.0 parts by weight per 100 parts by weight of the urethane prepolymer (i).
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