Curable resin composition, coating layer, and film

TW202631784APending Publication Date: 2026-08-01SEKISUI CHEMICAL CO LTD
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
SEKISUI CHEMICAL CO LTD
Filing Date
2025-10-23
Publication Date
2026-08-01
Patent Text Reader

Abstract

The object of this invention is to provide a curable resin composition that yields a cured product exhibiting excellent hardness, adhesion, and anti-discoloration properties even when exposed to high temperature and humidity environments. Furthermore, the object of this invention is to provide a coating layer and film formed using this curable resin composition. This invention is a curable resin composition comprising a curable resin, a coupling agent, and a polymerization initiator. The curable resin comprises a curable resin having two or more epoxy groups per molecule and lacking an aromatic ring. The coupling agent comprises a coupling agent having one glycidyl group per molecule. The content of the coupling agent having one glycidyl group per molecule is 10 parts by mass or more and 50 parts by mass or less relative to the total of 100 parts by mass of the curable resin and the coupling agent. none
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