Curable resin composition, coating layer, and film
TW202631784APending Publication Date: 2026-08-01SEKISUI CHEMICAL CO LTD
View PDF 0 Cites 0 Cited by
Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- SEKISUI CHEMICAL CO LTD
- Filing Date
- 2025-10-23
- Publication Date
- 2026-08-01
Abstract
The object of this invention is to provide a curable resin composition that yields a cured product exhibiting excellent hardness, adhesion, and anti-discoloration properties even when exposed to high temperature and humidity environments. Furthermore, the object of this invention is to provide a coating layer and film formed using this curable resin composition. This invention is a curable resin composition comprising a curable resin, a coupling agent, and a polymerization initiator. The curable resin comprises a curable resin having two or more epoxy groups per molecule and lacking an aromatic ring. The coupling agent comprises a coupling agent having one glycidyl group per molecule. The content of the coupling agent having one glycidyl group per molecule is 10 parts by mass or more and 50 parts by mass or less relative to the total of 100 parts by mass of the curable resin and the coupling agent. none
Need to check novelty before this filing date? Find Prior Art