Silver sinterable bonding material for bended dispensing tool and semiconductor device using the same

Abstract

This invention relates to a silver sinterable bonding material for bended dispensing tool, the sintered product, the assembly and the use thereof. In particular, the present invention relates to a silver sinterable bonding material which is capable of being stably sintered on various substrates such as copper, gold or silver with excellent idling disperse performance, good sintering strength and electricity properties.

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