Methods for manufacturing semiconductor adhesives, semiconductor adhesive wafers, and semiconductor devices

Abstract

A semiconductor adhesive containing a thermosetting resin, a curing agent, and a flux compound with acid groups is disclosed. The heat of generation (HG) in the 60–155 °C range, obtained by differential scanning calorimetry (DSC) measurement of the semiconductor adhesive at a heating rate of 10 °C / min, is less than 20 J / g. In the DSC curve, the onset temperature of the heating peak caused by the curing reaction is above 150 °C.

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