Composition for molding highly conductive articles

TW202631792APending Publication Date: 2026-08-01DIAHACHI CHEMICAL INDUSTRY CO LTD
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
DIAHACHI CHEMICAL INDUSTRY CO LTD
Filing Date
2025-11-26
Publication Date
2026-08-01
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Abstract

This invention provides a composition for molding conductive articles having high conductivity. This invention provides a composition comprising a polythiophene compound of general formula (A) and a lower alcohol compound, and for molding conductive articles. This invention also provides a method for molding conductive articles using the composition. In general formula (A), L is an alkyl group, etc. M1 and M2 are each independently an alkyl group or a hydrogen atom. R1A is a hydrogen atom, an alkyl group, an alkoxy group, an acetyl group, or a group represented by formula (15). L1, M1c, and M2c are the same as L, M1, and M2, respectively.
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