Underlayer composition for use in manufacturing electronic devices

Abstract

This article discloses a coating composition for use with an overcoated photoresist composition comprising: a thermally crosslinkable resin; and a compound having the following general formula (1): Wherein: W1, W2, W3 and W4 are independently single bonds or substituted or unsubstituted C1-5 alkyl groups; L1 and L2 are each ester groups; L3 and L4 are independently single bonds or groups selected from carbonyl or ester groups; R1 and R2 are independently hydrogen, halogen, substituted or unsubstituted C1-10 alkyl, or substituted or unsubstituted C3-10 cycloalkyl; R3 and R4 are independently hydrogen, halogen, hydroxyl, substituted or unsubstituted C1-10 alkyl, or substituted or unsubstituted C3-10 cycloalkyl; and solvent. Disclosed herein is a coating composition for use with an overcoated photoresist composition, consisting of: a thermally crosslinkable resin; a compound of the following general formula (1): wherein: W1, W2, W3, and W4 are independently a single bond or substituted or unsubstituted C1-5 alkylene; L1 and L2 are each an ester group; L3 and L4 are independently a single bond or a group chosen from carbonyl, or an ester group; R1 and R2 are independently hydrogen, halogen, substituted or unsubstituted C1-10 alkyl, or substituted or unsubstituted C3-10 cycloalkyl; R3 and R4 are independently hydrogen, halogen, hydroxyl, substituted or unsubstituted C1-10 alkyl, or substituted or unsubstituted C3-10 cycloalkyl; and a solvent.

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