Curable resin composition, dry film and cured product

Abstract

Provided: a curable resin composition that conforms to PFAS specifications and has improved resolution; a dry film having a resin layer formed by the curable resin composition; and a cured product formed by the resin layer of the curable resin composition or the dry film. One aspect of the present invention is a polyhydroxyamide compound comprising: a polyhydroxyamide compound having the structure of formula (1), a crosslinking agent, a photoacid generator, and a phenolic compound, wherein the polyhydroxyamide compound does not have a perfluoroalkyl backbone, and the weight average molecular weight of the phenolic compound is 5,000 or less. {In formula (1), R1 is a divalent organic group, and R2 is a tetravalent organic group.}