A method for micro-led mass transfer using temporary bonding adhesive, and the related micro-led mass transfer structure

Abstract

The present invention provides a temporary bonding adhesive for Micro-LED mass transfer, a Micro-LED mass transfer structure, and a method. During the mass transfer process, the temporary bonding adhesive serves as a protective layer for Micro-LED chips, reducing breakage and improving yield rates. It features a high absorption value at specific wavelengths and exhibits strong adhesion properties. By utilizing lower-energy laser irradiation, the Micro-LED chips can be smoothly released from the substrate for transfer, resulting in lower energy consumption and cost efficiency. The main components of the temporary bonding adhesive are a polyimide copolymer and epoxy resin. The polyimide copolymer contains aromatic structures and exhibits intramolecular and intermolecular charge transfer effects, leading to high laser absorption. This enables energy reduction and promotes energy efficiency. The epoxy resin further enhances adhesion, providing robust bonding performance.

Images