Polyimide precursor compositions, polyimide films, polyimide film / substrate laminates, flexible electronic devices, and flexible electronic device substrates.

Abstract

The polyimide precursor composition of the present invention contains a polyimide precursor, an alkoxysilane, and an imidazole compound. The polyimide precursor contains repeating units represented by formula (1) and satisfies specific conditions (e.g., the total amount of X1 present in the polyimide precursor is 50 mol% or more of a specific tetravalent aromatic group). [In formula (1), X1 is a tetravalent aromatic group, Y1 is a divalent aromatic group, R1 and R2 are each independently hydrogen atoms, etc.]