Polyimide precursor compositions, polyimide films, polyimide film / substrate laminates, flexible electronic devices, and flexible electronic device substrates.

A polyimide precursor composition with specific aromatic and aliphatic groups, alkoxysilane, and imidazole compounds improves transparency and heat resistance in polyimide films, suitable for laminates and electronic devices.

TW202631811APending Publication Date: 2026-08-01UBE CORPORATION
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Patent Information

Application Number
TW114137625
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-09-30
Filing Date
2025-09-30
Publication Date
2026-08-01

AI Technical Summary

Technical Problem

Existing polyimide precursor compositions, as described in Patent Document 1, provide polyimide films with high transparency and heat resistance but do not maximize these properties simultaneously.

Method used

A polyimide precursor composition containing a polyimide precursor with specific repeating units, alkoxysilane, and imidazole compounds, where more than 50 mol% of X1 is a tetravalent aromatic group and more than 50 mol% of Y1 is p-phenylene, along with a specific alkoxysilane content, is used to enhance transparency and heat resistance.

Benefits of technology

The composition enables the production of polyimide films with enhanced transparency and heat resistance, suitable for use in polyimide film/substrate laminates, flexible electronic devices, and substrates.

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Abstract

The polyimide precursor composition of the present invention contains a polyimide precursor, an alkoxysilane, and an imidazole compound. The polyimide precursor contains repeating units represented by formula (1) and satisfies specific conditions (e.g., the total amount of X1 present in the polyimide precursor is 50 mol% or more of a specific tetravalent aromatic group). [In formula (1), X1 is a tetravalent aromatic group, Y1 is a divalent aromatic group, R1 and R2 are each independently hydrogen atoms, etc.]
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