Polyimide precursor compositions, polyimide films, polyimide film / substrate laminates, flexible electronic devices, and flexible electronic device substrates.
A polyimide precursor composition with specific aromatic and aliphatic groups, alkoxysilane, and imidazole compounds improves transparency and heat resistance in polyimide films, suitable for laminates and electronic devices.
Patent Information
- Application Number
- TW114137625
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-09-30
- Filing Date
- 2025-09-30
- Publication Date
- 2026-08-01
AI Technical Summary
Existing polyimide precursor compositions, as described in Patent Document 1, provide polyimide films with high transparency and heat resistance but do not maximize these properties simultaneously.
A polyimide precursor composition containing a polyimide precursor with specific repeating units, alkoxysilane, and imidazole compounds, where more than 50 mol% of X1 is a tetravalent aromatic group and more than 50 mol% of Y1 is p-phenylene, along with a specific alkoxysilane content, is used to enhance transparency and heat resistance.
The composition enables the production of polyimide films with enhanced transparency and heat resistance, suitable for use in polyimide film/substrate laminates, flexible electronic devices, and substrates.