Carboxyl-modified amide resins, resin compositions, laminates and flexible printed wiring boards

Abstract

This invention provides a carboxyl-containing modified amide resin, which can be used as an adhesive for electronic components, or as a coating material for surface protective layers and insulating protective films, exhibiting excellent solution stability, elastic modulus, and heat resistance. This invention is a carboxyl-containing modified amide resin comprising: units derived from polyol (a), units derived from polyamine (b), and units derived from tetracarboxylic dianhydride (c), and having the structure shown in the following general formula (X) (in general formula (X), n represents a number from 0 to 20, R1 represents an organic group from tetracarboxylic dianhydride with the anhydride group removed, R2 represents an organic group from polyamine (b) with the amine group removed, and R3 represents an organic group from polyol (a) with the hydroxyl group removed); the polyamine (b) contains an aromatic diamine (b1), and the amide bond concentration is 0.5 to 2.0 mmol / g.