Polyimide film and method for producing same, metal-clad laminate, circuit board, multilayer circuit board, electronic device, and electronic equipment

Abstract

This invention provides a single-sided circuit board that suppresses adhesion of the insulating resin layer by altering its surface state. The polyimide film 10 has a three-layer stacked structure: a polyimide layer 11, a polyimide layer 12 adjacent to the polyimide layer 11, and a polyimide layer 13 adjacent to the polyimide layer 12. The polyimide layer 11 has a modified layer with an exposed modified surface MS. The concentration of fluorine atoms in the modified surface MS of the polyimide film 10, measured by X-ray photoelectron spectroscopy, is in the range of 25-50 atm%.

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