Copolymers, resin compositions, resin films, metal-clad laminates, circuit boards, electronic devices and electronic equipment

Abstract

A copolymer with excellent heat resistance and high-frequency transport characteristics is provided. The copolymer of the embodiment is a copolymer comprising a first structure containing two or more aromatic rings and a balance structure. The first structure is a structure in which the aromatic rings are bonded to each other by single bonds or linking groups. In the balance structure, the mass ratio of the sum of carbon atoms and hydrogen atoms to the total mass of the balance structure is 77 wt% or more, the mass ratio of carbon atoms to hydrogen atoms in the balance structure is 6.5 or more and 12.5 or less, the mass ratio of the first structure to the total mass of the copolymer is 15 wt% or more and 85 wt% or less, and in the linking groups, the number of atoms directly bonded to each other by the aromatic rings is 2 or less.