Curable resin composition, sealing material, and electronic components sealed by the cured product of the curable resin composition.

Abstract

This invention provides a curable resin composition comprising the following components: component (A), a multifunctional thiol compound having 3 to 6 thiol groups; component (B), a multifunctional epoxy compound having 3 to 4 epoxy groups that is liquid at 25°C and has an epoxy equivalent of 185 or less; and component (C), a monofunctional epoxy compound represented by Formula 1 below, wherein the ratio (thiol group / epoxy group) of the functional group concentration of component (A) to the functional group concentration of epoxy groups of component (B) is 0.6 to 1.3. This curable resin composition can form a cured product with excellent moisture resistance, low-temperature flexibility, and continuous folding and bending resistance (toughness).