Resin compositions and their manufacturing methods, cured products, and components and electronic devices

Abstract

This invention provides a resin composition comprising an organosilicone compound, exhibiting low viscosity change over time and excellent workability. The resin composition comprises an organosilicone compound having structures represented by formulas (A) and (B), wherein the proportion of the organosilicone compound having a structure represented by formula (B) with m=2 is greater than the proportion of the structure represented by formula (B) with m=1. In formula (A), R1 is independently an alkyl group having 1 to 40 carbon atoms, a cycloalkyl group having 5 or 6 carbon atoms, or an aryl group having 6 to 20 carbon atoms; R2 is independently an alkyl group having 1 to 40 carbon atoms, a cycloalkyl group having 5 or 6 carbon atoms, or an aryl group having 6 to 20 carbon atoms; in formula (B), R3 is independently an alkyl group having 1 to 40 carbon atoms, a cycloalkyl group having 5 or 6 carbon atoms, or an aryl group having 6 to 20 carbon atoms; in formula (B), m is an integer from 1 to 30.

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