Photosensitive resin composition and pattern formation method
TW202631831APending Publication Date: 2026-08-01SHIN ETSU CHEMICAL CO LTD
View PDF 0 Cites 0 Cited by
Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- SHIN ETSU CHEMICAL CO LTD
- Filing Date
- 2025-11-25
- Publication Date
- 2026-08-01
Abstract
The present invention provides a photosensitive resin composition comprising (A) a polysiloxane backbone, a polysiloxane backbone and a fluorene backbone in the main chain and an aminocarbamate bond, a carboxyl group and an acrylonitrile or methacrylamide group in the side chain, and (B) a photoradix generator.
Need to check novelty before this filing date? Find Prior Art