Resin compositions, cured products, resin composites, prepregs, foil-coated laminates, printed wiring boards, and semiconductor devices.

Abstract

This invention provides a resin composition that, when hardened, achieves flame retardancy, low dielectric constant, and low warpage, as well as a hardened product, a resin composite sheet, a prepreg, a metal-coated laminate, a printed wiring board, and a semiconductor device. The solution of this invention is that the disclosed resin composition includes a compound (A) represented by formula (I) and a thermosetting compound (B), wherein the thermosetting compound (B) includes a compound represented by formula (M1), and the content of compound (A) is 2 to 20 parts by mass relative to 100 parts by mass of the resin solids in the resin composition.