Resin compositions, cured materials, resin composites, prepregs, foil-coated laminates, printed wiring boards, and semiconductor devices.

Abstract

This invention provides resin compositions, as well as cured products, resin composite sheets, prepregs, metal-coated laminates, printed wiring boards, and semiconductor devices. The disclosed resin compositions comprise thermosetting resins, inorganic fillers, and core-shell organic fillers, with the core-shell organic filler comprising 10-25% by volume of 100% of the total volume of the inorganic filler and the core-shell organic filler.