Electromagnetic wave shielding composition and electromagnetic wave shielding circuit board using the same
TW202631853APending Publication Date: 2026-08-01ステムコカンパニーリミテッド
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Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- ステムコカンパニーリミテッド
- Filing Date
- 2025-11-26
- Publication Date
- 2026-08-01
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Abstract
This invention relates to a composition for electromagnetic wave shielding. It is suitable for shielding electromagnetic waves generated by electronic components and can be achieved with a thin thickness. Even when the surface to which it is applied is a flexible material, it prevents cracks, warping, or peeling caused by shape deformation, thus exhibiting excellent adhesion and durability.
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