Heat dissipating filler, resin composition and resin molded body

TW202631856APending Publication Date: 2026-08-01U-MAP CO LTD
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
U-MAP CO LTD
Filing Date
2026-01-20
Publication Date
2026-08-01

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    Figure TWG2TA001071741_003
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Abstract

μm; and aluminum nitrides formed into a fibrous shape, wherein, when a total amount of the first heat conductive particles, the second heat conductive particles, the third heat conductive particles and the aluminum nitrides formed into the fibrous shape is
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