Sheet material, semiconductor chip holding member, and method for manufacturing semiconductor chip holding member

TW202631867APending Publication Date: 2026-08-01SUMITOMO BAKELITE CO LTD
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
SUMITOMO BAKELITE CO LTD
Filing Date
2025-12-09
Publication Date
2026-08-01

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Abstract

The present invention provides a sheet material, a semiconductor chip holding member, and a method for manufacturing a semiconductor chip holding member, each capable of achieving both pickup properties of a semiconductor chip and ensured holding force of the semiconductor chip. The sheet material of the present invention is a sheet material used to hold a semiconductor chip. The sheet material is composed of a material containing a thermoplastic elastomer. Further, the sheet material is characterized in that a material constituting a semiconductor chip holding portion has a tack strength of
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