resin composition
TW202631876APending Publication Date: 2026-08-01AJINOMOTO CO INC
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Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2025-11-24
- Publication Date
- 2026-08-01
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Abstract
The objective of this invention is to provide resin compositions that can form cured products with excellent dielectric properties, elongation, and adhesion before and after HAST testing. The solution to the above objective is a resin composition comprising: (A) a polyimide resin containing either a dimericamine backbone or a melamine backbone, and a fluorene backbone; and (B) a thermosetting resin.
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