Resin composition, prepreg, film with resin, metal foil with resin, metal clad laminate and wiring board

Abstract

The present invention discloses a resin composition that achieves both good formability and resistance to electrical traces. The resin composition comprises an epoxy resin (A), a phenolic resin (B), and an inorganic filler (C). The epoxy resin (A) comprises a dicyclopentadiene-type epoxy resin (A1) and a phenol-methane-type epoxy resin (A2). The inorganic filler (C) comprises: a first inorganic filler (C1) exhibiting a first peak in a volumetric particle size distribution measurement; and a second inorganic filler (C2) exhibiting a second peak with a particle size smaller than the first peak in a volumetric particle size distribution measurement. The first inorganic filler (C1) and the second inorganic filler (C2) are each selected from at least one filler selected from the group consisting of aluminum hydroxide filler, borosilicate filler, magnesium hydroxide filler, sodium aluminum carbonate filler, calcium aluminate hydrate filler, calcium borate filler, and zinc borate filler.

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