Thermosetting resin compositions, prepregs, resin films, laminates, printed circuit boards, antenna devices, antenna modules and communication devices, as well as methods for manufacturing thermosetting resin compositions and prepregs.

TW202631879APending Publication Date: 2026-08-01RESONAC CORP
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
RESONAC CORP
Filing Date
2025-12-11
Publication Date
2026-08-01
Patent Text Reader

Abstract

A thermosetting resin composition containing titanate is provided, exhibiting excellent sieveability. Furthermore, a prepreg, resin film, laminate, printed circuit board, antenna device, antenna module, and communication device are provided, all obtained using this thermosetting resin composition. A method for manufacturing the aforementioned thermosetting resin composition and a method for manufacturing the aforementioned prepreg are also provided. Specifically, the aforementioned thermosetting resin composition is a thermosetting resin composition containing: (A) a thermosetting resin; and (B) an amorphous titanate obtained by calcination at 1,150°C or higher. none
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