Hardening components

Abstract

The present invention aims to provide a curable composition with excellent processability and permeability to narrow slits. This curable composition can form a curable material with excellent electrical properties (low relative permittivity, low dielectric tangent, etc.) and moisture resistance, as well as mechanical properties and insulation. It is applicable to electronic components such as sealing materials, extension films, or underfill materials for semiconductor devices. The solution is: a curable composition comprising an epoxy resin, an amine-based curing agent, and hollow silica particles surface-treated with a silane coupling agent. The silane coupling agent has an amine group or a group capable of addition reaction with an amine group; and the hollow silica particles have an average particle size (D50) of 0.5 µm or more.