Thermosetting resin compositions, dry films, cured products, and printed wiring boards

Abstract

The object of this invention is to provide a thermosetting resin composition that can form a hardened material with high thermal conductivity and high adhesion to a substrate. The technical means to solve this problem is to incorporate epoxy resin, a thermally conductive filler, and a polyalkylene glycol derivative into the thermosetting resin composition, wherein the aforementioned thermally conductive filler is substantially free of magnetic particles.