Methods for manufacturing resin compositions for substrate bonding, multilayers, and semiconductor devices.

Abstract

This invention provides a resin composition for substrate bonding, a method for manufacturing a laminate, and a method for manufacturing a semiconductor device. The aforementioned resin composition for substrate bonding is a resin composition containing a resin, wherein the resin contains at least one of a polyimide precursor and polyimide. The resin content is 50% by mass or more relative to the total solid content of the resin composition. The resin composition is applied to the surface of a first substrate having a step difference of 10 μm from the surface of a first substrate to form a resin film, and a second substrate without a step difference is brought into contact with the resin film and bonded by heating and pressure. The peel strength between the first substrate and the second substrate is 10 J / m² or more.

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